國立臺灣大學機械工程學系

首頁系所成員教授專任教授李貫銘

系所成員

教授

專任教授

兼任教授

名譽/退休教授

職員

助教室

李貫銘

中文姓名：李貫銘

職稱：教授

任職期間：

英文姓名：Kuan-Ming Li

Email：kmli@ntu.edu.tw

聯絡電話：02-3366-9473

傳真： 02-2363-1755

辦公室：機械館603室

影響區域：創新

研究所組別：製造組

實驗室：精密製造實驗室 (機械館331室)

個人網頁

個人簡介

個人簡介
研究領域
教學課程
研究計畫
研究著作

學歷

美國, 喬治亞理工學院, 機械工程學系, 博士
國立台灣大學, 機械工程學系, 碩士
國立台灣大學, 機械工程學系, 學士

微量潤滑

切削加工過程監控

電腦輔助製造

金屬成型

雷射加工

電腦輔助製造

振動輔助微銑削之研究(99/08/01 ～ 100/07/31)

期刊論文 (Journal Papers)：Corresponding Author(通訊作者)*

Ding, Chien-Fang, Lee, Meng-Shiou and Li, Kuan-Ming*, “Low-cost camera based laser power monitoring and stabilizing for micro-hole drilling,” International Journal of Precision Engineering and Manufacturing, v18, n9, 2017, p 1205–1212. (SCI) (MOST 104-2221-E-002-035)
Chen, Pin-Chuan, Chen, Yu-Chieh, Pan, and Li, Kuan-Ming, “Parameter optimization of micromilling brass mold inserts for microchannels with Taguchi method,” International Journal of Precision Engineering and Manufacturing, v 16, n 4, 2015, p 647-651 (SCI)
Tseng, Shih-Chieh, Tang, Chao-Wei*, Liao, Hsueh-Chuan, Li, Kuan-Ming, and Young, Hong-Tsu, “Investigation of silicon-based light emitting diode submounts: Enhanced performance and potential for improved reliability,” Materials Science in Semiconductor Processing, v 31, 2015, p 604-610 (SCI)
Chen, Pin-Chuan*, Pan, Chang-Wei, Lee, Wei-Chen, and Li, Kuan-Ming, “An Experimental Study of Micromilling Parameters to Manufacture Microchannels on a PMMA Substrate,” International Journal of Advanced Manufacturing Technology, v 71, n 9-12, 2014, p 1623-1630 (SCI)
Chen, Pin-Chuan*, Pan, Chang-Wei, Lee, Wei-Chen, and Li, Kuan-Ming, “Optimization of Micromilling Microchannels on a Polycarbonate Substrate,” International Journal of Precision Engineering and Manufacturing, v 15, n 1, 2014, p 1-6 (SCI)
Li, Kuan-Ming*, Wang, Chia, and Chu, Wei-Yin, “An Improved Remote Sensing Technique for Estimating Tool-Chip Interface Temperatures in Turning,” Journal of Materials Processing Technology, v 213, n 10, p 1772-1781, 2013 (SCI) (國科會計畫編號: NSC 101-2221-E-002-011)
Li, Kuan-Ming* and Wang, Shang-Lan, “Effect of Tool Wear in Ultrasonic Vibration-Assisted Micro-Milling”, Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, v 227, n 12, December, 2013 (SCI) (國科會計畫編號: NSC 99-2628-E-110-5)
Li, Kuan-Ming*, “Experimental Study on Minimum Quantity Lubrication in Mechanical Micromachining,” Advanced Materials Research, v 579, 2012, pp. 193–200 (EI) (國科會計畫編號: NSC97-2221-E-110-024-MY2)
Tang, Chao-Wei*, Li, Kuan-Ming, and Young, Hong-Tsu, "Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process," Micro & Nano Letters, v 7, n 7, 2012, pp. 693–696 (SCI)
Li, Kuan-Ming and Lin, Cheng-Peng, “Study on Minimum Quantity Lubrication in Micro-Grinding,” International Journal of Advanced Manufacturing Technology, v 62, n 1-4, September, 2012, pp 99-105 (SCI) (國科會計畫編號: NSC97-2221-E-110-024-MY2)
Li, Kuan-Ming*, Hu, Yang-Ming, Yang, Zhong-Yi and Chen, Ming-Yuan, "Experimental Study on Vibration-Assisted Grinding," Journal of Manufacturing Science and Engineering, v 134, n 4, August 2012, 041009 (8 pages). (SCI) (國科會計畫編號: NSC97-2221-E-110-024-MY2)
Tang, Chao-Wei*, Young, Hong-Tsu and Li, Kuan-Ming, "Innovative Through-silicon-via Formation Approach for Wafer-level Packaging Applications," Journal of Micromechanics and Microengineering, v 22, n 4, April 2012, 045019 (8 pages) (SCI)

國際會議論文 (International Conference Papers)

Wang, Chia, Huang, Men, Chung, Tien-Tung, Young, Hong-Tsu and Li, Kuan-Ming*, “Tool Condition Monitoring with Current Signals for a Low-power Spindle,” 2017 IEEE International Conference on Applied System Innovation, Japan, May 13-17, 2017 (MOST 105-2221-E-002-231)
Ding, Chien-Fang, Lee, Meng-Shiou, and Li, Kuan-Ming*, “Development of on-line laser power monitoring system,” Proceedings Volume 9732, Real-time Measurements, Rogue Events, and Emerging Applications, San Francisco, California, United States, February 13-18, 2016, (MOST 104-2221-E-002-035)
Li, Kuan-Ming*, Liao, Yin-Chih, and Chang, Jia-How, “Development of a Miniaturized Temperature Sensor for Cutting Temperature Estimation,” Proceedings of 5th International Conference on Advanced Manufacturing (ICAM2014), Chiayi, Taiwan, September 30 – October 3, 2014. (國科會計畫編號: NSC 101-2221-E-002-011)
Liu, Yao-Chih, Lin, Sin-Liang, Tsai, Heng-Kuang, Li, Kuan-Ming, Chen, Fuh-Kuo*, and Lin, Yi-Kai, “Characteristics of Advanced High Strength Steel Sheets under Cyclic Reversed Bending,” Proceedings of 5th International Conference on Advanced Manufacturing (ICAM2014), Chiayi, Taiwan, September 30 – October 3, 2014.
Li, Kuan-Ming* and Wang, Shang-Lan, “Effect of Tool Wear on Tool Life and Surface Roughness in Ultrasonic Vibration-Assisted Micro-Milling”, Proceedings of 16th International Conference on Advances in Materials & Processing Technologies (AMPT 2013), Taipei, Taiwan, September 22-26, 2013 (國科會計畫編號: NSC 99-2628-E-110-5)
Wang, Chia, Chu, Wei-Ying, Li, Kuan-Ming*, “Estimation of Transient Cutting Temperature by Remote Thermocouple Sensing Technique” The 8th International Conference on Micro-Manufacturing (ICOMM 2013), Victoria, BC, Canada, March 25-28, 2013. (國科會計畫編號: NSC 101-2221-E-002-011)
Lee, Guan-Liang, Chen, Jau-Horng*, Li, Kuan-Ming, “A Pulsed-Biasing Strain Gauge Measurement System for Wireless Sensing Applications”, Proceedings of the ASME 2012 International Symposium on Flexible Automation (ISFA2012), St. Louis, MO, USA, June 18 – 20, 2012.
Li, Kuan-Ming*, “Experimental Study on Minimum Quantity Lubrication in Mechanical Micromachining,” Proceedings of the 4th International Conference on Advanced Manufacturing (ICAM2012), Jiaoxi, Yilan County, Taiwan, March 4-8, 2012 (國科會計畫編號: NSC97-2221-E-110-024-MY2)
Li, Kuan-Ming, Hu, Yang-Ming, Yang, Zhong-Yi, Chen, Ming-Yuan and Hsu, Fu-Chuan, “Effect of Machining Parameters on Surface Roughness in Vibration-assisted Grinding,” ASME 2011 International Manufacturing Science and Engineering Conference (MSEC2011), Volume 2, Corvallis, Oregon, USA, June 13-17, 2011, pp. 359-364. (EI) (國科會計畫編號: NSC97-2221-E-110-024-MY2)