學歷

南澳大利亞大學, 先進製造與機械博士, 2000

自傳

　　陳亮嘉博士目前為國立臺灣大學（NTU）機械工程學系的特聘教授，博士學位取得自澳洲南澳大利亞大學製造與機械工程系，主要研究領域涵蓋精密量測與精密系統工程。其研究方向包括精密量測技術、自動化光學量測與檢測設備、半導體量測與設備、顯微光學量測與系統，以及機器視覺與自動化影像辨識技術的發展。

　　陳博士於1991至1995年間曾任職於核能研究所，專注於自動化超音波非破壞檢測技術與設備的研發。隨後，他於1996至2001年間在澳洲 CLIPSAL 電子公司擔任專任研究工程師，累積了豐富的製造科技與自動化機器視覺檢測系統開發經驗。2001年8月，陳博士返國，加入台北科技大學自動化科技研究所，從事自動化光學量測與微奈米三維量測系統相關的研究與教學工作。

　　陳博士曾擔任國際測量與儀器委員會（ICMI）主席，現為國際標準組織 ISO TC14 委員會成員。此外，他積極參與多個專業學術組織，目前著有兩本教科書、四部專書章節，發表超過150篇國際期刊論文、250篇國際會議論文，並擁有60項發明專利。他在2024年及2025年分別榮列 Stanford/Elsevier - Top 2% Scientists，並獲選為第一屆台大 Garmin 講座。

經歷

• 2011/08-迄今，國立台灣大學, 特聘教授

• 2019/05-迄今，中華民國自動化科技學會, 理事

• 2018/11-迄今，亞洲精密工程學會之 Board member (Asian Society for Precision Engineering and Nanotechnology, ASPEN). (台灣地區代表)

• 2018/01-迄今，三項國際期刊Editor: International Journal of Precision Engineering and Manufacturing, Nanomanufacturing and Metrology, Advanced Sciences.

• 2018/01-迄今，International Measurement Confederation (國際量測聯邦, IMEKO), 國際工程學術組織 (ISO), Board member (in TC14). (台灣地區代表)

• 2017/09-迄今，國際量測技術委員會之Board member (ICMI, the International Committee on Measurements and Instrumentation). (台灣地區代表)

• 2017/03-迄今，台灣精密工程學會, 理事

• 2014/05-迄今，中華民國計量工程學會, 理事

• 2000/01-迄今，自動光學檢測設備聯盟 (AOIEA), 執行委員及兼任副會長

• 2014-2017 國立台灣大學, 自動化研究中心主任

• 2008-2011，國立台北科技大學, 特聘教授

• 2001-2011，國立台北科技大學, 專任教師

• 1997/07-2001/07，CLIPSAL Pty. Ltd., Australia Research Engineer

• 1991/10-1994/07，原委會核能研究所, 助理研究員

學會代表

1. 國際量測聯邦和國際工程學術組織台灣地區理事(IMEKO & ISO, Board member (in TC14)) 
2. 國際量測技術委員會之台灣地區理事(ICMI, Board member)
3. 亞洲精密工程學會台灣地區理事( ASPEN, Board member)

國際學術期刊編輯

1. Editor, International Journal of Precision Engineering and Manufacturing, 2018迄今
2. Editor, Nanomanufacturing and Metrology, 2018迄今
3. Editor, Advanced Sciences (SCI), 2018迄今

學術榮譽及獎項 

1. 2024.12第一屆台大Garmin講座
2. 2022 科技部 未來科技獎
3. 2022年宗倬章先生講座
4. 2022年東元科技獎
5. 2022年中國機械工程學會傑出工程教授獎
6. 2022年科技部傑出研究獎
7. 2015年科技部傑出研究獎
8. 2014年年度傑出技術移轉貢獻獎
9. 2014年年度國家發明創作獎金牌
10. 2014年臺大機械系年度研究貢獻獎
11. 2013年年度國家發明創作獎金牌
12. 2012年年度國家發明創作獎銀牌
13. 2011年中國工程師協會年度傑出工程教授獎

指導學生獲獎

1. 2024.12 第21屆上銀機械碩士論文獎 銀質獎
   
2. 2024.7 全國AI智動化設備創作獎 銀獎
   
3. 2023.12 第20屆上銀機械碩士論文獎 優等獎
   
4. 2022.12 第20屆上銀機械碩士論文獎 金質獎
   
5. 2021, 博士生楊福生、碩士生陳泓叡、碩士生周煜峰，榮獲 致茂精密機械與量測技術論文獎 金獎。
   
6. 2021, 碩士生陳家宏、廖承鈺，榮獲 精密工程論文獎 銅獎。
   
7. 2021, 碩士生黃聖皓，榮獲 第十八屆上銀機械碩士論文獎 佳作。
   
8. 2023, 博士生楊福生、碩士生洪彥鴻、碩士生吳旻儒、碩士生傅子英、碩士生廖承鈺，榮獲 15th International Symposium on Measurement Technology and
9. Intelligent Instruments (ISMTII 2023) 最佳論文獎（Best paper awards）。
   
10. 2023, 碩士生鄭育廷、碩士生李維耘，榮獲 The 10th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN
11. 2023) 最佳論文獎 (Best paper awards)

研究領域

精密量測 / 光學量測 / 逆向工程與三維重建 / 微奈米量測 / 自動化光學檢測 / DSP影像處理技術 / 智慧型自動化系統

實驗研究方向

　　在高科技產業蓬勃發展之下，舉精密機械、微機電系統，乃至今日大放異采的電子產業、IC製造、IC 先進封裝與測試等，都顯示出精密定位系統與精密量測的重要性。本實驗室以上述精密工程以及半導體先進製程之精密量測需求為主軸，發展各式光學量測與光機電整合技術，光學部分包含3D掃描、共焦、干涉等技術，機電部分則包含機構設計、電子電路知識及軟體程式編寫。

　　本實驗室之研究重點在於創新性AOI光機電關鍵技術與系統模組之突破，範圍包括精密量測系統之光機創新設計與系統整合、智能化關鍵演算法開發、符合阿貝原理之奈米級精密量測關鍵技術與平台的開發、創新式智能化AOI量測系統之開發、以及半導體先進製程之線上檢測技術與設備開發等，以協助科技產業開發前瞻性關鍵技術突破與方法創新，為精密量測實驗室最重要之研究發展目標。

精密量測

自動化光學檢測原理與應用

工廠實習

奈米工程技術概論

1. (113-2218-E-002-046-)半導體先進封裝製程之線上智能化AOI關鍵檢測技術與虛實整合系統研發－半導體先進封裝製程之線上智能化AOI關鍵檢測技術與虛實整合系統研發
2. (112-2221-E-002-148-MY3)基於光學模型深度學習發展半導體製程關鍵尺寸之超解析精密量測研究與設備研發
3. 111年度，「以深度學習為基礎之深紫外光式三維矽穿孔臨場檢測模組－以深度學習為基礎之深紫外光式三維矽穿孔臨場檢測模組」(1/4)(111-2218-E-027-004-)，共同主持人，計畫期間:2022/06/01~ 2026/05/31，委託單位:國科會。(四年期)
4. 110年度，「創新式全域高速彩色共焦量測探頭關鍵技術之研發與零阿倍三軸晶圓掃描平台之整合系統及最佳化」(110-2221-E-002-120-MY3)，主持人，計畫期間: 2021/08/01~ 2024/07/31，委託單位:國科會。(四年期)
5. 110年度，「以人工智慧及次世代全基因組定序尋找心房顫動基因及轉譯研究」(110-2314-B-002-198-MY3)，共同主持人，計畫期間: 2021/08/01~ 2024/07/31，委託單位:國科會。(三年期)
6. 110年度，「半導體先進封裝製程之線上智能化AOI關鍵檢測技術與虛實整合系統研發－半導體先進封裝製程之線上智能化AOI關鍵檢測技術與虛實整合系統研發」((110-2218-E-002-036-)，主持人，計畫期間: 2021/06/01~ 2025/05/31，委託單位:國科會。(四年期)
7. 110年度，「具高深寬比次微米級矽穿孔與微結構之創新性量測關鍵系統與技術研發」，主持人，計畫期間: 2021/06/01~ 2025/05/31，委託單位: 揚明光學股份有限公司。(四年期)。
8. 109年度，「基於LCoS之全域彩色共焦三維形貌顯微量測系統與關鍵技術研發」 （109-2622-E-002 -006 -CC2），主持人，計劃期間2020/06/01/~2021/10/31，委託單位：致茂電子股份有限公司。（兩年期）
9. 109年度，「先進自動化光學檢測設備研發聯盟」 （109-2622-8-002 -017 -TE3），主持人，計劃期間2020/02/01/~2023/01/31，委託單位：國科會。（三年期）
10. 108年度，「精密加工與檢測基礎技術」((108-2218-E-002-001-)，共同主持人，計畫期間: 2019/10/01~ 2021/03/31，委託單位:國科會。（四年期）
11. 108年度，「先進智慧型機器人光學精密量測模組開發與系統整合」(108-2218-E-002-005-)，主持人，計畫期間: 2019/06/01~ 2021/08/31，委託單位:國科會。（四年期）
12. 108年度，「機器手臂運動位置與姿態偵測技術研究」，主持人，計畫期間: 2019/09/01~ 2022/12/31，委託單位: 承湘科技
13. 108年度，「自動化X光衰減器開發」，主持人，計畫期間: 2019/05/21~ 2019/11/30，委託單位: 財團法人工研院
14. 108年度，「創新性三維形貌量測探頭模組與演算技術研究開發案」，主持人，計畫期間: 2019/03/31~ 2022/03/30，委託單位: 捷智科技有限公司。(三年期)
15. 108年度，「內視三維技術」，主持人(技術顧問)，計畫期間: 2019/02/01~ 2019/07/31，委託單位: 醫電頂眾公司。

期刊論文  (Journal Papers)：Corresponding Author(通訊作者)*

1. Liang-Chia Chen*, Guo-Wei Wu, Sanjeev Kumar Singh, Wei-Hsin Chein (2024), “Diffractive image microscopy for 3D imaging,” Springer, ISBN 978-981-97-7781-5, 2024.
2. Chen-Yu Liao, Hsi-Hui Lin, Wei-Hsin Chein and Liang-Chia Chen∗ (2024), “Miniaturized laser interferometer using dynamic current-wavelength modulation for high precision displacement measurement,” Meas. Sci. Technol. 36 (2025) 015040.
3. Wei-Hsin Chein, Fu-Sheng Yang, Komal Thakur, Guo-Wei Wu, Liang-Chia Chen* (2023) , “Non-integral depth measurement of high-aspect-ratio multi-layer microstructures using numerical-aperture shaped beams,” Optics and Lasers in Engineering 161 107384.
4. Guo-Wei Wu and Liang-Chia Chen* (2023) “Resolving measurement ambiguity in diffractive image microscopy for 6DOF surface measurement using designed aberration and multiple-layer perceptron,” The International Journal of Advanced Manufacturing Technology (SCI), 2023, https://doi.org/10.1007/s00170-023-11147-0. (IF:3.77, Industrial and Manufacturing Engineering (Q1)) Published: 01 March 2023
5. Wei-Hsin Chein, Fu-Sheng Yang, Zi-Ying Fu and Liang-Chia Chen* (2023) “Non-integral model-based scatterometry for CD metrology of single high-aspect-ratio microstructures,” Surface Topography: Metrology and Properties, 2023, 11.2:024004. (Impact Factor:2.185, SCI)
6. Yu-Sheng Chen, Liang-Chia Chen* (2023), “3-D optical microscopy with a new synthetic SFF algorithm to reconstruct surfaces with various specular and diffusive reflectance,” The International Journal of Advanced Manufacturing Technology (SCI), 2023, Accepted. (IF:3.77, Industrial and Manufacturing Engineering (Q1))
7. Hong-Ruei Chen and Liang-Chia Chen* (2023),“Full-field chromatic confocal microscopy for surface profilometry with sub-micrometer accuracy,“ Optics and Lasers in Engineering 161 (2023) 107384 (SCI).
8. Ryo Sato, Xing-Hui Li, Andreas Fischer, Liang-Chia Chen, Chong Chen, Rintaro Shimomura and Wei Gao (2023) “Signal processing and artificial intelligence for dual-detection confocal probes,” International Journal of Precision Engineering and Manufacturing, 2023, (已接受, Impact Factor: 4.66, SCI)
9. Liang-Chia Chen*, Nguyen Van Thai, Bo-Ching He, (2023) “Precise CD measurement of micro grating linewidth using multi-view AFM stitching method,” Journal of the Chinese Society of Mechanical Engineers, Volume 44 No.1 : 23-36(2023) (SCI).
10. Liang-Chia Chen*, Sheng-Hao Huang, Bo-Han Huang, (2022) “Precise 6DOF localization of robot end effectors using 3-D vision and registration without referencing targets,” IntechOpen, Book Chapter (專章), the Open Access book, Vision Sensors - Recent Advances, 2022.10.1. (非SCI期刊)
11. Liang-Chia Chen*, Xuan-Loc Nguyen (2022) “Novel 3-D object segmentation using efficient region-growing algorithm with classification of surface features,” Image & Recognition, Vol. 28 No. 1, 2022. (非SCI期刊)
12. Liang-Chia Chen*, Pei-Ju Tan, Guo-Wei Wu, Chih-Jer Lin, and Duc Trung Nguyen, (2021) “High-speed chromatic confocal microscopy using multispectral sensors for sub-micrometer-precision microscopic surface profilometry,” Measurement: Sensors 18 (2021) 100165.
13. Yuki Shimizu*, Liang-Chia Chen*, Dae Wook Kim, Xiuguo Chen, Xinghui Li and Hiraku Matsukuma, (2021) “An insight on optical metrology in manufacturing,” Measurement science and technology, Meas. Sci. Technol. 32 042003, 2021. (SCI)
14. Fu-Sheng Yang, Chao-Ching Ho*, Liang-Chia Chen (2021)” Automated Optical Inspection System for O-Ring Based on Photometric Stereo and Machine Vision,” Applied Sciences Pub Date : 2021-03-15 , DOI: 10.3390/app11062601( IF 2.679 )
15. Guo-Wei Wu, Liang-Chia Chen*, (2021)“Precise 3-D microscopic profilometry using diffractive image microscopy and artificial neural network in single-exposure manner,” Optics and lasers engineering, Volume 147, December 2021, 106732 (SCI, IF: 5.67, Rank 38/596, 6.2%, 傑出期刊等級).
16. Fan-Chun Kuo, Chekang Hsu, Meng-Ru Hsieh, Jia-Yush Yen, Liang-Chia Chen, Tien-Tung Chung, Fu-Cheng Wang, “Study on the transient response to the point-to-point motion controls on a dual-axes air-bearing planar stage,” The International Journal of Advanced Manufacturing Technology, 111, 2759–2772 (2020). (SCI)
17. Duc-Hieu Duong, Chin-Sheng Chen and Liang-Chia Chen* (2019), “Absolute Depth Measurement Using Multiphase Normalized Cross-Correlation for Precise Optical Profilometry,” Sensors 2019, 19, 4683; doi:10.3390/s19214683. (SCI)
18. Kuang-Chao Fan, Liang-Chia Chen* (2019), “Special Issue on Precision Dimensional Measurements,” Appl. Sci. 2019, 9, 3314; doi:10.3390/app9163314.
19. Liang-Chia Chen* (2019), Duc-Hieu Duong, Chin-Sheng Chen, “Novel Optical 3-D Profilometry for Measuring Semiconductor Wafer Surfaces with Extremely Variant Reflectivities,” Appl. Sci. 2019, 9, 2060; doi:10.3390/app9102060. (SCI)
20. Guo-Wei Wu, Duc Trung Nguyen, and Liang-Chia Chen* (2019), “Novel full-field micro surface profilometry using diffractive image correlation without vertical scanning,” Optics letters, Vol. 44, Issue 14, pp. 3534-3537, 2019. (SCI)
21. Liang-Chia Chen*, Thanh-Hung Nguyen (2019) , “A novel surface descriptor for automated 3-D object recognition and localization,” Sensors, 2019 Feb; 19(4): 764. (doi: 10.3390/s19040764)
22. Liang-Chia Chen⁎ and Ching-Wen Liang (2018), “Novel Boundary Edge Detection for Accurate 3D Surface Profilometry Using Digital Image Correlation,” Appl. Sci. 2018, 8, 2541; doi:10.3390/app8122541. (SCI)
23. Liang-Chia Chen⁎, Pei-Ju Tan, Chih-Jer Lin, Duc Trung Nguyen, Yu-Shuan Chou, Nguyen Dinh Nguyen, Nguyen Thanh Trung (2018), “Innovative full-field chromatic confocal microscopy using multispectral sensors,” Optics, arxiv.org/abs/1812.06573.
24. Liang-Chia Chen* (2018), “Confocal microscopy for surface profilometry,” Book chapter, Metrology, Springer, ISBN 978-981-10-4937-8, doi:10.1007/978-981-10-4912-5_3-1.
25. Duc Trung Nguyen and Liang-Chia Chen* (2018), “Development of novel one-shot full-field surface profilometer using chromatic confocal microscopy,” Optics, arxiv.org/abs/1812.06578.
26. Liang-Chia Chen*, Pei-Ju Tan, Guo-Wei Wu, Chih-Jer Lin, and Duc Trung Nguyen, “High-speed chromatic confocal microscopy using multispectral sensors for sub-micrometer-precision microscopic surface profilometry,” Measurement: Sensors, 18(2021) 100165.
27. Liang-Chia Chen*, Sheng-Hao Huang, Bo-Han Huang, “Precise 6DOF localization of robot end effectors using 3-D vision and registration without referencing targets,” accepted by IntechOpen, Book Chapter, the Open Access book, Vision Sensors - Recent Advances, September 2022.
28. Wei-Hsin Chein, Fu-Sheng Yang, Zi-Ying Fu, Liang-Chia Chen*, “Novel Scatterometry Technique for Critical Dimension Metrology of High-Aspect-Ratio Microstructures”, Instruments Today 235, Published: 16 June 2023.
29. 傅子英, 簡維信, 楊福生, 陳亮嘉*, “基於類神經網路輔助之深紫外光譜散射術應用於次微米級高深寬比結構之關鍵尺寸量測,” 機械新刊, 第九卷第二期，二○二四年二月號。

國際會議論文  (International Conference Papers)

1. Fu-Sheng Yang, Min-Ru Wu, Yen-Hung Hung, Zih-Ying Fu, Liang-Chia Chen, "AI-enhanced optical critical dimension metrology for high aspect ratio structures in semiconductor advanced packaging," Proc. SPIE 12956, Novel Patterning Technologies 2024, 129560Y (9 April 2024).
2. Yu-Ting Cheng, Wei-Yun Lee, Ming-Jie Liu, Wei-Hsin Chein and Liang-Chia Chen*, “AI-powered deconvolution-based super-resolution imaging for semiconductor OCD metrology and precise stage positioning”, SPIE Advanced Lithography + Patterning 2024, February 25-29, 2024, California, USA
3. Wei-Hsin Chein, Gaurav Pandey, Surajit Das, Liang-Chia Chen*, "Advancements in metrology for advanced semiconductor packaging," Proc. SPIE 12997, Optics and Photonics for Advanced Dimensional Metrology III, 129970R (18 June 2024).
4. Fu-Sheng Yang, Min-Ru Wu, Yen-Hung Hung, Yuan-Ci Lin, Bo-Chen Kuo, and Liang-Chia Chen*, “New SWIR Hyperspectral Diffraction Imaging for OCD Metrology of High Aspect Ratio Submicron Structures”, XXIV IMEKO World Congress, August 26-29, 2024, Hamburg, Germany.
5. Yen-Hung Hung, Min-Ru Wu, Fu-Sheng Yang, Yuan-Ci Lin, Bo-Chen Kuo, Liang-Chia Chen*, “Global Sensitivity Analysis and Application for Measuring Sub-Micron High Aspect Ratio Structures Based on DUV Scatterometry”, XXIV IMEKO World Congress, August 26-29, 2024, Hamburg, Germany.
6. Min-Ru Wu, Fu-Sheng Yang, Yen-Hung Hung, Bo-Chen Kuo, Yuan-Ci Lin, and Liang-Chia Chen*, “New Broadband Spectral Reflectometry for Multi Critical Dimension Metrology of HAR Sub-Micrometer Trench Structures”, XXIV IMEKO World Congress, August 26-29, 2024, Hamburg, Germany.
7. Yu-Ting Cheng, Ming-Jie Liu, Yu-Tang Huang, Liang-Chia Chen*, “Advanced Optics-Powered Resolution Enhancement Using Convolutional Neural Networks for Critical Dimension Metrology in Bright-Field Microscopy”, XXIV IMEKO World Congress, August 26-29, 2024, Hamburg, Germany.
8. Hsi-Hui Lin, Yi-Yuan Lu, Hao-Jun Li, Tong-Yao Han and Liang-Chia Chen*, “Design and Optimization of a Quasi-Abbé-Error-Free Three-Axis Wafer Measurement Platform”, The 20th International Conference on Precision Engineering (ICPE2024), October 23-27, 2024, Sendai, Japan.
9. Fu-Sheng Yang, Min-Ru Wu, Yen-Hung Hung, Yuan-Ci Lin, Bo-Chen Kuo and Liang-Chia Chen*, “New DUV Wavelength-Scanning Scatterometry for Sub-Micron High-Aspect-Ratio OCD Metrology”, The 20th International Conference on Precision Engineering (ICPE2024), October 23-27, 2024, Sendai, Japan.
10. Ming-Jie Liu, Yu-Ting Cheng, Yu-Tang Huang, and Liang-Chia Chen*, “Enhancing Optical Lateral Resolution through Deep Learning-Based Estimation of Zernike Coefficients from System Transfer Functions”, The 20th International Conference on Precision Engineering (ICPE2024), October 23-27, 2024, Sendai, Japan.
11. Han-Ju Tsai, Wei-Chi Hung, Ching-Chia Yen, Liang-Chia Chen*, “Enhanced 3D Surface Profilometry of Chromatic Confocal Microscopy with Spatially Varying Richardson-Lucy Deconvolution”, The 20th International Conference on Precision Engineering (ICPE2024), October 23-27, 2024, Sendai, Japan.
12. Yen-Hung Hung, Min-Ru Wu, Fu-Sheng Yang, Bo-Chen Kuo, Yuan-Ci Lin, Surajit Das, and Liang-Chia Chen*, “Optimizing Fourier Hyperspectral Scatterometry with Global Sensitivity Analysis for Semiconductor OCD Metrology”, The 20th International Conference on Precision Engineering (ICPE2024), October 23-27, 2024, Sendai, Japan.
13. Yu-Tang Huang, Yu-Ting Cheng, Ming-Jie Liu, Liang-Chia Chen*, “3D PSF deconvolution to enhance optical critical dimension measurement and extend effective depth-of-focus in microscopy,” Impact 2024.
14. Surajit Das, Wei-Hsin Chein, Yen-Hung Hung, Fu-Sheng Yang, Liang-Chia Chen*, ”A Theoretical Study on the Global Analysis of New Multimodal Optical Metrology for Critical Dimension (CD) Measurement and Stress Analysis in Advanced Semiconductor Packaging, “ Impact 2024.
15. Gaurav Pandey, Chun-Yu Liu, Wei-en Fu, Chao-Ching Ho, Liang-Chia Chen*, “Modeling of scattering intensity in transmission-small angle x-ray metrology using elements of fourier optics to simplify the modeling of critical features at the FEOL stage of emerging IC designs,” Optic 2024.
16. Fu-Sheng Yang, Yen-Hung Hung, Min-Ru Wu, Zih-Ying Fu, Chen-Yu Liao and Liang-Chia Chen*, “An AI-powered Diffraction Imaging Approach for Optical Critical Dimension Metrology,” International symposium of measurement technology and intelligent instruments (ISMTII 2023), September 17-20, 2023, Seoul, South Korea.
17. Liang-Chia Chen*, “Current advances and challenges in optical metrology for advanced semiconductor packaging,” International symposium of measurement technology and intelligent instruments (ISMTII 2023), September 17-20, 2023, Seoul, South Korea. (Keynote)
18. Liang-Chia Chen*, “AI-powered OCD metrology on high aspect ratio structures in semiconductor manufacturing,” International Symposium on Upcoming Prominent Engineering Solutions (ISUPEN 2023), September 29, 2023, Online, Japan.
19. Guo-Wei Wu and Liang-Chia Chen, “Accuracy-enhanced diffraction image profilometry using external aberration for resolving image ambiguity,” SPIE Europe 2022.
20. Wilson Chien, Komal Thakur, Guo-Wei Wu, Fu-Sheng Yang, Liang-Chia Chen,” New critical dimension optical metrology for submicron high-aspect-ratio structures using spectral reflectometry with supercontinuum laser illumination,” SPIE Europe 2022.
21. Liang-Chia Chen*, Pei-Ju Tan, Guo-Wei Wu, Chih-Jer Lin, and Duc Trung Nguyen, “High-speed chromatic confocal microscopy using multispectral sensors for sub-micrometer-precision microscopic surface profilometry,” XXIII IMEKO World Congress “Measurement: sparking tomorrow’s smart revolution”, August 30- September 3, 2021, Yokohama, Japan.
22. Liang-Chia Chen*, ”Technological advances on optical precision metrology,” Plenary talk, IFUPE 2021 August 30 – September 1 (on-line), 2021, Qiqihar, China.
23. Wei-Hsin Chein, Komal Thakur, Fu-Sheng Yang, Zi-Ying Fu and Liang-Chia Chen*, “DUV optical microscopy for measuring high-aspect-ratio sub-micron structures,” ASPEN2022.
24. Bo-Han Huang and Liang-Chia Chen*, “High-speed multi-Line structured-light 3-D scanning system for accurate surface profilometry,” ASPEN2022.
25. Chen-Yu Liao, Yu Hung, Fu-Sheng Yang and Liang-Chia Chen*, “Development of a novel multifunctional Abbé-free 12”-wafer measuring stage for semiconductor manufacturing,” ASPEN2022
26. Hong-Ruei Chen, Yu-Feng Chou, Fu-Sheng Yang, Han-Ju Tsai, Wei-Jei Peng, and Liang-Chia Chen, “Galvo-scanning chromatic confocal microscopy for high-speed 3-D surface measurement,” ASPEN 2022
27. Wei-Yun Lee, Fu-Sheng Yang, and Liang-Chia Chen, “Parametric point-spread-function model optimization for microscopic image super-resolution,” ASPEN 2022.
28. Yu-Feng Chou, Fu-Sheng Yang, Han-Ju Tsai, and Liang-Chia Chen, “Development of Multipoint Galvano-scanned chromatic confocal surface microscopy for AOI,” ICMT 2022.
29. Liang-Chia Chen, “Recent Advances in Automated Optical Inspection and Metrology for In-Line Manufacturing,” PRESM 2022.
30. Guo-Wei Wu, Liang-Chia Chen, “Precise single-exposure microscopic surface profilometry using artificial neural network,” IFMI & ISPEMI 2022.
31. Guo-Wei Wu and Liang-Chia Chen, “Precise 3-D microscopic profilometry using diffractive image microscopy and artificial neural network in single-exposure manner,” AIE 2022.
32. His-Hui Lin, Chen-Yu Liao, Liang-Chia Chen*, “Gas-Cell Locked Frequency Scanning Interferometry Achieving High-speed Absolute Displacement Measurement,” International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2023), November 21-24, 2023, Hong Kong, China.
33. Zih-Ying Fu, Fu-Sheng Yang, Min-Ru Wu, Yen-Hung Hung and Liang-Chia Chen*, “AI-guided numerical-aperture-controlled scatterometry for measurement of deep HAR and thin-film structures with a large depth variation,” SPIE optical metrology 2023.
34. Wei-Hsin Chein, Fu-Sheng Yang, Zi-Ying Fu and Liang-Chia Chen*, “Non-integral model-based scatterometry for single-structure OCD metrology,” SPIE optical metrology 2023.
35. Chen-Yu Liao, His-Hui Lin, Liang-Chia Chen*, “Development of a fiber laser interferometer for precise displacement measurement using wavelength modulation interferometry,” Ilmenau scientific colloquium (ISC 2023), September 4-8, 2023, Ilmenau, Germany.
36. Wei-Yun Lee, Liang-Chia Chen*, “AI-guided optical-model-based superresolution for semiconductor CD metrology,” SPIE Metrology, Inspection, and Process Control XXXVII, AL23 SPIE Advanced Lithography + Patterning, 2023.
37. Fu-Sheng Yang, Zih-Ying Fu, Liang-Chia Chen*, “AI-guided OCD metrology for single HAR sub-micron via measurement” SPIE Metrology, Inspection, and Process Control XXXVII, AL23 SPIE Advanced Lithography + Patterning 2023, February 26 – March 02 2023, San Jose CA, US.
38. Zih-Ying Fu, Wei-Hsin Chein, Fu-Sheng Yang, Liang-Chia Chen*, “Artificial-neural-network-assisted DUV scatterometry for OCD on HAR sub-micron structures” SPIE Metrology, Inspection, and Process Control XXXVII, AL23 SPIE Advanced Lithography + Patterning 2023, February 26 – March 02 2023, San Jose CA, US.
39. Guo-Wei Wu, Ming-Jun Jiang, Liang-Chia Chen, “Precise microscopic profilometry using diffractive image correlation and theoretical model simulation”, SPIE Optical Engineering + Applications, 2019, San Diego, California, United States
40. Guo-Wei Wu, Ming-Jun Jiang, Liang-Chia Chen, “Investigation and mapping strategy on influence of surface tilting in diffractive pattern correlation profilometry”, SPIE Optical Engineering + Applications, 2019, San Diego, California, United States
41. Johannes Belkner, Hsiu-Wen Liu, Eberhard Manske, Liang-Chia Chen, “Novel chromatic confocal differential interference contrast prototype”, SPIE Optical Metrology, 2019, Munich, Germany

國內會議論文  (Domestic Conference Papers)

1. 陳封霖， 林沛群， 陳亮嘉*, “ 雷射金屬積層製造中直接能量沉積技術的在製程中加工軌跡調整方法,”第33屆國防科技學術研討會, NOV., 2024.
2. 傅子英, 簡維信, 楊福生, 陳亮嘉*, “基於類神經網路輔助之深紫外光譜散射術應用於次微米級高深寬比結構之關鍵尺寸量測,” 機械新刊, 第九卷第二期，二○二四年二月號。
3. 陳泓叡、楊福生、周煜峰、陳亮嘉*，振鏡掃描式全域彩色共焦表面形貌量測系統之研發，2022年致茂精密機械與量測技術論文獎 (金獎)
4. 陳家宏、廖承鈺、陳亮嘉*，應用電光調制光干涉原理於創新式奈米解析度位移量測技術與模組之研發，2022年致茂精密機械與量測技術論文獎
5. 陳亮嘉、廖承鈺、陳家宏，應用電光調制光干涉原理於創新式奈米解析度位移量測技術與模組之研發, 110年精密工程專題與論文獎競賽.
6. Hao-Hui Yang, Wei-Yun Lee, and Liang-Chia Chen, “DIC Microscopy Using Novel Quadriwave Lateral Shearing Interferometry for On-shot Surface Profilometry,” Automation 2022.
7. Wei-Yun Lee, Fu-Sheng Yang, and Liang-Chia Chen,” Optimization deconvolution with simulated optical point spread function for image super-resolution technique,” AOIEA 2022.
8. Sheng-Hao Huang, Bo-Han Huang, Liang-Chia Chen*, ” Precise 6DOF localization of robot end effectors using 3-D vision and registration without target artefacts,” Accepted in September, the 18th International Conference on Automation Technology (Automation 2021), November 12-14, 2021, Kimmen, Taiwan.
9. Min-Ru Wu, Yen-Hung Hung, Fu-Sheng Yang, Yuan-Ci Lin, Bo-Chen Kuo and Liang-Chia Chen*, “SWIR OCD Metrology for Semiconductor High Aspect Ratio Structures: Sensitivity Analysis and Simulation,” International Conference on Automation Technology (Automation 2023), December 8-10, 2023, Taipei, Taiwan.

專書 & 章節

1. Liang-Chia Chen*, Guo-Wei Wu, Sanjeev Kumar Singh, Wei-Hsin Chein (2024), (2024) “Diffractive image microscopy for 3D imaging,” Springer, ISBN 978-981-97-7781-5, 2024. (Book)
2. Liang-Chia Chen, Vision Sensors - Recent Advances, Book chapter “Precise 6DOF Localization of Robot End Effectors Using 3D Vision and Registration without Referencing Targets ”, IntechOpen, ISBN 978-1-83768-210-2, Book Chapter.
3. Liang-Chia Chen, Confocal Microscopy for Surface Profilometry, Chapter 3, Metrology, Springer Singapore, Book Chapter.
4. 陳亮嘉等，自動化光學檢測(ISBN 978-986-378-009-0)，高立圖書， 2015, 1, 1出版(Book).
5. Liang-Chia Chen, “High-speed Fourier transform profilometry for reconstructing objects having arbitrary surface colours,” Book chapter, Recent Advances in Topography Research, 2013.
6. 陳亮嘉, 精密檢測技術: 數位光學三維精密量測 (章), 2004.